| 摘要: |
| 分析了金刚石复合片中金刚石颗粒与粘结剂Co-Si合金之间的连接行为。通过扫描电镜、电子探针及X射线衍射分析,结果表明:在一定条件下,金刚石颗粒周围有Si元素偏聚;金刚石颗粒与结合剂之间有新生化合物SiC存在;烧结时间是影响SiC生成的主要因素之一。由于SiC的存在,使金刚石工具的使用寿命得到提高。 |
| 关键词: 金刚石 固相 连接 |
| DOI： |
| 分类号: |
| 基金项目:哈尔滨工业大学"现代焊接生产技术"国家重点实验室基金 |
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| Solid-state Bonding of Diamond to Co-Si Alloys |
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Sun Fenglian1, Yu Yandong1, Sun Pingzhong1, Zhang Jie2, Zhang Jiuhai2, Xu Yonghua3
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1.Harbin University of Science and Technology;2.Harbin Institute of Technology;3.Heilongjiang Institute of Commerce
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| Abstract: |
| The paper has investigated the sticking or welding behaviour between diamond grain and adhesive Co-Si alloys in the man-made diamond compacts by SEM,EPMA and X-ray diffraction. It is found that element Si tends to the bondary of diamond grain; there are new chemical compounds SiC in the boundary between diamond grain and adhesives. This prolongs the service life of diamond tools. Perhaps the sintering time is the main factor of forming SiC. |
| Key words: diamond solid bonding |
