| 摘要: |
| 对GH4141高温镍基合金的扩散连接进行了工艺研究,确定了扩散连接工艺参数对室温抗剪强度的影响,确定了获得优质接头的最佳工艺参数区间,即扩散连接温度T=990~1080℃,连接时间t=15~60 min,连接比压力p=5~20 MPa,选用Ni箔作为中间层,厚度为25 μm。通过SEM、EPMA和金相技术对接头微观组织进行了观察和分析。 |
| 关键词: 镍基合金 扩散连接 中间层 GH4141合金 |
| DOI： |
| 分类号: |
| 基金项目: |
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| Diffusion bonding of GH4141 superalloy |
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HAN Wen-bo, ZHANG Kai-feng, WANG Guo-feng
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School of Materials Science and Engineering, Habin Institute of Technology, Harbin 150001, China
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| Abstract: |
| Diffusion bonding parameters including bonding temperature T,pressure P,time t,affecting the mechanism of joints of GH4141 superalloy,were studied.When the specimen bonded with 25 pm thicknickel foil interlayer was elongated at room temperature,shear fracture of the joints take place at the GH4141 wlloy.The microstructure shows an excellent bending at the interfaces.The optimum parameters for the diffusion bonding are:T=990 1080~C,P=520 MPa,t=1560 min. |
| Key words: nickel-base alloy diffusion bonding nickel foil inter-layer GH4141 alloy |
