微米Sn-Ag-Cu-RE粉体材料的制备与表征

薛松柏; 禹胜林

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微米Sn-Ag-Cu-RE粉体材料的制备与表征
薛松柏¹, 禹胜林²
1.南京航空航天大学, 南京 210016;2.中国电子科技集团第十四研究所, 南京 210013

摘要:

首次制备出了微米Sn-Ag-Cu-RE合金粉体,微米Sn-Ag-Cu-RE合金粉体呈圆滑的球形,粒度呈梯度分布,其铺展性能、扩展率都得到了显著的改善。微米Sn-Ag-Cu-RE合金粉体固相线温度为190.643~193.645℃,较块体Sn-Ag-Cu合金的熔点221℃降低了28℃;液相线温度为216.963~218.368℃,较块体Sn-Ag-Cu合金的熔点降低了3℃。试验结果表明,微米Sn-Ag-Cu-RE合金粉体的"表面效应"显著。该文为无铅钎料的研发和应用提供了一个新的思路。

关键词: 无铅钎料 Sn-Ag-Cu合金固相线液相线

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Preparation and characterization on micron powder solder of Sn-Ag-Cu-RE

XUE Song-bai¹, YU Sheng-lin²

1.Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China;2.14th Institute, China Electronics Technology Group Corporation, Nanjing 210013, China

Abstract:

The micron powder solder of Sn-Ag-Cu-RE was prepared for the first time.The powder particles are spherical in shape, scattered over steps and the spread ability and spreading ratio of the powder solder are improved obviously.The solidus of the micron powder solder is in the range of 190.643℃-193.645℃ and the liquidus in the range of 216.963℃-218.368℃ which reduced 28℃ and 3℃ respectively compared with block solder.The experimental results indicate that the "surface effect" of the micron powder solder is remarkable, and it is a new method for the development and application of lead free solders.

Key words: lead free solder Sn-Ag-Cu alloy solidus liquidus