| 摘要: |
| 通过对Sn、Cu混合粉末的机械球磨,利用X射线衍射仪、差热热分析仪和扫描电镜对粉末进行了检测与分析,研究了不同球磨条件对Sn-0.7Cu合金形成的影响。结果表明,电压、球料比及球磨时间对Sn-0.7Cu合金的形成有很大影响。对于Sn-Cu二元系,其机械合金化反应机制是通过机械诱发原子扩散,使原子间发生置换固溶和晶界溶解,而逐渐形成Cu6Sn5等合金相的。 |
| 关键词: 机械合金化 Sn-0.7Cu合金 球磨条件 反应机制 |
| DOI： |
| 分类号: |
| 基金项目:国家863计划项目(2002AA322040);北京市自然科学基金资助项目(012003);北京市教育委员会资助项目(05009012200201) |
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| Effect of ball milling condition on formation of Sn-0.7Cu alloy |
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LIU Xin, XIA Zhi-dong, LEI Yong-ping, SHI Yao-wu
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The Key Laboratory of Advanced Functional Material Ministry of Education China, Beijing University of Technology, Beijing 100022, China
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| Abstract: |
| The mixed Sn and Cu powder was milled by mechanical ball milling.The milled powders were analyzed by X-ray diffraction,differential thermal analyzer and scanning electron microscope.The effect of ball milling conditions on the formation of Sn-0.7Cu alloy was investigated.The results showed that voltage,ball-to-powder mass ratio,and milling time affect the formation of Sn-0.7Cu alloy significantly.The mechanism of mechanical alloying Sn-Cu was that the mechanically-induced atom diffusion drives substitutional solid solution and interface dissolution,as a result of which Cu6Sn5 was formed. |
| Key words: mechanical alloying Sn-0.7Cu alloy ball milling condition reactive mechanism |
