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| CBGA焊点热循环条件下的可靠性 |
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薛松柏1, 胡永芳1, 禹胜林2
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1.南京航空航天大学材料科学与技术学院, 南京 210016;2.中国电子科技集团第十四研究所, 南京 210013
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| 摘要: |
| 研究了陶瓷球栅阵列(CBGA)器件在-55~125℃温度循环条件下的热疲劳寿命,采用光学显微镜研究了失效试件焊点的失效机制,分析了裂纹萌生和扩展的方式。结果表明,失效试件裂纹最先萌生于四周最外侧焊球上下界面外边缘处,随着循环次数的增加,裂纹沿该界面从焊球边缘向中心扩展,裂纹的萌生和扩展是该处应力应变集中、热循环和蠕变相互作用的结果。 |
| 关键词: 热疲劳寿命 球栅阵列 裂纹 热循环 |
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| 基金项目:南京航空航天大学引进人才科研基金项目(S0462-061) |
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| Reliability of CBGA soldered joint under thermal cycling |
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XUE Song-bai1, HU Yong-fang1, YU Sheng-lin2
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1.College of Materials Science & Technology, Nanjing University of Aeronautics & Astronautics, Nanjing 210016, China;2.The 14~(th)Research Insitute, China Eletronics Technology Group Corporation, Nanjing 210013, China
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| Abstract: |
| Thermal fatigue life of ceramic ball grid array(CBGA)devices under thermal cycling conditions was presented in -55℃~125℃.Failure mechanism of the soldered joints including the germinating position and expanding direction of the cracks were observed and analyzed by optical microscopy.Results show that the crack in soldered joints germinats in the borderline all around the out most solder balls.With the increasing of thermal cycling times,the cracks expand from the borderline of out most solder balls to the ball center along the interfaces.It is found that the germination and expanding of the micro-cracks are caused by highly concentrated stress and strain as well as interaction between thermal cycling and creep. |
| Key words: thermal fatigue life BGA crack thermal cycling |
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