| 摘要: |
| 采用金属粉末67Cu-33Mn,67Cu-33Mn-5Ni(质量百分比)为中间层对W与Cu合金进行了瞬时液相连接,利用SEM、EDX分别对试样进行显微组织及成分分析,并探讨其连接机理。结果表明,中间层67Cu-33Mn-5Ni获得的接头比中间层67Cu-33Mn的显微组织更致密,结合性更好。分析认为,Ni的加入,提高了中间层溶质的扩散率,加速了液相的等温凝固;Ni还溶解一定量的W,形成Ni(W)固溶体。其连接机理是通过中间层Cu-Mn形成液相,与母材Cu实现瞬时液相连接;与母材W实现钎焊连接。 |
| 关键词: 瞬时液相连接 钎焊 显微组织 机理 |
| DOI： |
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| Tansient liquid phase bonding tungsten to copper alloy |
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SHEN Yi-fu1, LIU Shi-fu1, LI Jun-wei2, XU Jie1
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1.College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Jiangsu Nanjing 210016, China;2.XiaMen Honglu Corporation, Fujian Xiamen 361021, China
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| Abstract: |
| Transient liquid phase bonding of Tungsten (W) to copper (Cu) alloy using 67Cu-33Mn or 67Cu-33Mn-5Ni (mass fraction) as the interlayer was studied. The microstructures and chemical composition across the bond interface were analyzed by using SEM and EDX. The microstructure of TLP joint using 67Cu-33Mn-5Ni as the interlayer was denser than that of the TLP joint using 67Cu-33Mn as the interlayer. The addition of Ni plays an important role in increasing diffusion rate, isothermally solidification rate and in Ni(W) solid solution formation. The bonding mechanism of W to Cu alloy is found to be a combination of TLP bonding and brazing. The TLP acts as a feasible bonding mechanism of the Cu-Mn interlayer and the Cu alloy, while the brazing mechanism prevails between the interlayer and the W. |
| Key words: transient liquid phase bonding brazing microstructures mechanism |
