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| 矩形片式电阻半导体激光钎焊无铅焊点的热循环试验 |
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韩宗杰1, 薛松柏1, 王俭辛1, 禹胜林1,2, 费小建1,3, 张亮1
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1.南京航空航天大学材料科学与技术学院, 南京 210016;2.中国电子科技集团公司第14研究所, 南京 210013;3.广州中船远航文冲船舶工程有限公司, 广州 510727
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| 摘要: |
| 选用Sn-Ag-Cu无铅钎料,采用半导体激光软钎焊和红外再流焊两种方法对0805型矩形片式电阻元件进行钎焊,并对采用不同方法得到的钎焊焊点进行热循环试验。结果表明,激光软钎焊矩形片式电阻焊点的力学性能优于传统红外再流焊工艺所获得的电阻焊点的力学性能;片式电阻焊点的剪切力随热循环次数的增加呈现下降趋势,在热循环次数相同时,激光软钎焊焊点的力学性能优于红外再流焊焊点。随着热循环次数的增加,片式电阻焊点的剪切断裂的方式由明显的韧性断裂逐渐向脆性断裂转变。 |
| 关键词: 矩形片式电阻 Sn-Ag-Cu无铅焊点 半导体激光钎焊 热循环 |
| DOI： |
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| 基金项目:江苏省普通高校研究生科研创新计划资助项目(CX07B_087z);江苏省"六大人才高峰"资助项目(06-E-020) |
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| Thermal cycling of rectangular chip resistor joints soldered with lead-free solder by diode laser |
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HAN Zongjie1, XUE Songbai1, WANG Jianxin1, YU Shenglin1,2, FEI Xiaojian1,3, ZHANG Liang1
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1.College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China;2.The 14th Research Institute, China Electronics Technology Group Corporation, Nanjing 210013, China;3.Guangzhou CSSC-Ocean-Gws Marine Engineering Co. , Ltd. , Guangzhou 510727, China
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| Abstract: |
| Soldering experiments of rectangular chip resistor components were carried out with Sn -Ag -Cu lead-free solder by diode laser soldering system and IR reflow soldering method, respectively, and the thermal cycling test of chip resistor component joints was also carried out.It is found that mechanical properties of chip resistor joints soldered by laser soldering system are better than the ones of chip resistor joints soldered by IR reflow soldering method; shear forces of chip resistor joints decrease gradually with the increasing of thermal cycling times, while at the same time, shear forces of laser soldered joints are larger than that of IR soldered joints.Shear fracture mode of chip resistor joints change from toughness fracture to brittle fracture as thermal cycling times increase. |
| Key words: rectangular chip resistor Sn -Ag -Cu leadfree joints diode laser soldering thermal cycling |
