Bi对Sn-0.3Ag-0.7Cu无铅钎料熔点及润湿性能的影响

孙凤莲; 胡文刚; 王丽凤; 马鑫

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Bi对Sn-0.3Ag-0.7Cu无铅钎料熔点及润湿性能的影响
孙凤莲¹, 胡文刚¹, 王丽凤¹, 马鑫²
1.哈尔滨理工大学材料科学与工程学院, 哈尔滨 150040;2.亿铖达工业有限公司, 广东深圳 518101

摘要:

研究了添加适量的Bi元素对低银型Sn-0.3Ag-0.7Cu无铅钎料合金性能的影响,应用差示扫描量热仪和SAT-5100型润湿平衡仪对Sn-0.3Ag-0.7Cu-xBi(x=0,1,3,4.5)钎料的熔点、润湿性能作了对比试验分析。结果表明,一定量Bi元素的加入可以降低Sn-0.3Ag-0.7Cu钎料合金的熔点,并改善其润湿性能。但过多的Bi元素会导致钎料的液固相线温度差增大,塑性下降,造成焊点剥离缺陷。综合考虑得到Sn-0.3Ag-0.7Cu-3.0Bi无铅钎料具有最佳的综合性能。

关键词: 无铅钎料熔点润湿性焊点剥离

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基金项目:国家自然科学基金资助项目(50575060);哈尔滨科技创新人才研究专项基金项目(RC2006QN006012)

Influence of Bi on the melting point and wettability of Sn-0.3Ag-0.7Cu lead-free solder

SUN Fenglian¹, HU Wengang¹, WANG Lifeng¹, MA Xin²

1.School of Materials Science & Engineering, Harbin university of Science and Technology, Harbin 150040, China;2.Yik shing Tat Industrial Corporation limited Company, Shenzhen 518101, Guangdong, China

Abstract:

The influences of Bi on the melting point and wettability of Sn-0.3Ag-0.7Cu lead-free solder alloy were studied.The contrastive experiments and analysis on the melting point, wettability of Sn-0.3Ag-0.7Cu-xBi (x=0, 1, 3, 4.5)solders were carried out by differential scanning calorimetry and wetting balance equipment. Results show that the addition of Bi can decrease the melting point and improve the wettability of Sn-0.3Ag-0.7Cu lead-free solder alloy.But the amount of Bi should be limited.Because the excess element of Bi could increase the melting range of solder, decrease the plasticity of solder and result in the flaw of fillet lifting.Sn-0.3Ag-0.7Cu-3.0Bi lead-free solder performed an excellent cornprehensive properties.

Key words: lead-free solder melting point wettability fillet lifting