Sn-3.0Ag-0.5Cu-xNi无铅焊料及焊点的性能

Properties of Sn-3.0Ag-0.5Cu-xNi lead-free solders and soldering joints

关键词:  无铅钎料  润湿性  抗剪强度

Key words:  lead-free solder  wettability  shear strength

摘要:

研究了Ni元素对Sn-3.0Ag-0.5Cu无铅钎料熔点、润湿性、拉伸性能及焊点性能的影响.结果表明,镍的添加对Sn-3.0Ag-0.5Cu钎料的润湿性有所改善,添加量为0.03%~0.1%时,随着镍含量的增加,润湿时间逐渐递减,润湿力逐渐增大,镍含量在0.05%时润湿时间最短,镍含量在0.1%时润湿力最大.但当镍含量到0.15%时,润湿时间反而增长,润湿力下降;镍提高了合金的抗拉强度、断后伸长率及焊点的抗剪强度.当镍含量为0.05%时,抗拉强度最高,当镍含量为0.1%时,断后伸长率和抗剪强度最高,扫描断口表现为明显的韧性断裂特征;镍的添加量为0.05%~0.1%效果较好。

Abstract:

The influences of the addition Nickel to Sn-3. 0Ag-0.5Cu lead-free solder on the melting point, wettability, tensile properties and the properties of soldering joints were studied.The results show that the solder alloy exhibited improved wettability with the addition of small amount of Nickel.The wetting time decreases gradually and the wetting force increases gradually as Nickel content is within 0.03 %~0.1%.When Nickel content is 0.05% the wetting time is the shortest.When Nickel content is 0.1% the wetting force is the biggest.The solder alloy exhibited very little change on the melting point.The solder alloy of the addition of Nickel exhibited improved elongation percentage and shear strength.When Nickel content is 0.1%, the elongation percentage and shear strength are the highest.Scanning fracture exhibits obvious ductility characteristic.The suitable of addition to the solder Nickel is within 0.05%~0.1%.