| 摘要: |
| 采用扫描电镜、X射线衍射、能谱仪及电子拉伸试验机等测试方法研究了Cu箔作中间层瞬间液相扩散连接(TLP)Al-Si合金接头的组织和力学性能.结果表明,Al-Si合金基体中的Al元素与中间层Cu元素发生共晶反应形成液相,而合金中的Si对Al与Cu的相互作用有一定的阻碍.接头组织主要由α-Al、单晶Si及金属间化合物(CuAl2和Al4Cu9)组成,而金属间化合物的数量随连接时间的增加而减少.剪切试样沿着界面/基体处断裂.当温度为560℃时,随着连接时间的增加,接头抗剪强度先增大后减小,在120min时达到最大值70.2MPa;接头塑性和韧性提高,断口表面形貌由脆性特征转变为脆性和韧性共存的混合型断裂特征。 |
| 关键词: Al-Si合金 瞬间液相扩散连接 显微组织 力学性能 |
| DOI： |
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| 基金项目:国家自然科学基金资助项目(50575091);吉林大学国家大学生创新性实验计划项目(2008A43024) |
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| Microstructure and mechanical property of transient liquid phase bonded aluminum silicon alloy joint |
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ZHANG Weihua1, QIU Xiaoming1, CHEN Xiaowei1, ZHAO Xihua1, SUN Daqian2, LI Yongqiang1
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1.School of Materials Science and Engineering, Jilin University, Changchun 130022, China;2.Key Laboratory of Automobile Materials, Ministry of Education, Jilin University, Changchun 130022, China
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| Abstract: |
| Microstructure and mechanical property of the transient liquid phase bonded aluminum silicon alloy joints with Cu interlayer were investigated by means of scanning electron microscope, X-ray diffractometry, energy dispersive X-ray spectroscope and electronic tensile testing machine.The results indicate that Cu interlayer reacts with Al from Al-Si alloy to form eutectic liquid phase, and Si from Al-Si alloy will prevent the reaction to some extent.The microstructure of the joint consists of α-Al, Si and intermetallic compounds(CuAl2 and Al4Cu9), meanwhile, the amount of the intermetallic compounds decrease with the increasing of bonding time.The fracture occurs at the bonding region/base metal interface during shear strength testing.With the increase of bonding time, the shear strength of the joint increases firstly and then declines, while 70.2 MPa can be achieved after bonding at 560℃ for 120 min.In addition, a transition from brittle to hybrid brittle and ductile morphology of the fracture surface was found with the increasing of bonding time. |
| Key words: aluminum silicon alloy transient liquid phase bonding microstructure mechanical property |
