| 摘要: |
| 在Sn-Sb-Cu三元钎料合金中添加微量元素Ag和Ni,通过合金化形成Sn-Sb-Cu-Ag和Sn-Sb-Cu-Ni两种新型四元无铅钎料合金,以改善基体钎料性能.结果表明,在Sn-Sb-Cu钎料合金中添加微量元素Ag,合金熔化温度较基体钎料下降,铺展面积增大,这与钎料过热度增大,形成弥散低熔点相SnAg和液态钎料表面张力减小有关;添加微量元素Ni,合金熔化温度较基体钎料下降,铺展性能稍稍变差,这是因为添加微量元素Ni后,Sn-Sb-Cu-Ni液态钎料粘度提高,表面张力增大.且在钎料与铜基板处形成了多面体形状(Cu,Ni)6Sn5,且该相覆盖在Cu6Sn5表面,不利于液态钎料的润湿铺展。 |
| 关键词: Sn-Sb-Cu合金 无铅钎料 熔化温度 铺展性能 |
| DOI： |
| 分类号: |
| 基金项目:"十一五"国家科技支撑计划(2006BAF04B14);河南省科技攻关项目(072102260016);洛阳市科技攻关项目(0801038A) |
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| Effect of Ag and Ni on melting temperature and spreadability of Sn-SbCu solder alloy |
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FENG Lifang1, YANG Li2, YAN Yanfu1, GUO Xiaoxiao1, ZHANG Keke1
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1.Henan Key Laboratory of Advanced Non-ferrous Metals, Henan University of Science and Technology, Luoyang 471003, Henan, China;2.College of Electro-mechanical Technology, Xuzhou Institute of Technology, Xuzhou 221008, Jiangsu, China
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| Abstract: |
| In order to improve the properties of the Sn-10Sb-8Cu solder alloy, two new lead-free solders(Sn-Sb-Cu-Ag and Sn-Sb-Cu-Ni) were made by adding small amounts of Ag and Ni into Sn-10Sb-8Cu solder alloy.Results show that the melting temperatures of the Sn-Sb-Cu-Ag solder alloys decrease and the spreading areas increase compared with those of the matrix solders, which are related to the increase of the superheat degree, the dispersed distribution of SnAg phase with low melting point and the decrease of the surface tension of the melting solder.The melting temperatures of the Sn-Sb-Cu-Ni solder alloys decrease and the spreading areas of the Sn-Sb-Cu-Ni solder alloys are slightly less than those of the matrix solders. It is because the viscous and the surface tension of the Sn-Sb-Cu-Ni melting solder increase and the Cu6Sn5 is covered by the polyhedron-shape(Cu,Ni)6Sn5 which is adverse to the spreadability of the solder by adding small amount of Ni. |
| Key words: Sn-Sb-Cu alloy lead-free solder melting temperature spreadability |
