| 摘要: |
| 采用真空扩散连接技术对GH4169合金进行了焊接,分析了GH4169合金接头界面结构及扩散连接工艺参数对界面扩散孔隙及接头力学性能的影响.结果表明,GH4169直接扩散连接,在连接温度为950~1150℃的范围内,随着温度的升高,连接时间的延长和连接压力的增大,界面的扩散孔隙数目逐渐减少,尺寸逐渐变小,接头抗拉强度达到658 MPa,但接头依旧有不连续的孔洞存在.采用铜中间层进行GH4169的扩散连接时,在界面处有固溶体层生成,接头抗拉强度得到明显的提高,最高可达745MPa. |
| 关键词: 镍基高温合金 扩散连接 中间层 抗拉强度 |
| DOI： |
| 分类号: |
| 基金项目:哈尔滨工业大学优秀团队计划资助项目 |
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| Microstructure and properties of GH4169 vacuum diffusion bonded joint |
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LI Zhuoran1, YU Kang2, LIU Bing1, FENG Jicai1
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1.State Key Lab of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China;2.Shanghai Institute of Space Propulsion, Shanghai 200233, China
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| Abstract: |
| The vacuum diffusion bonding process was used to weld GH4169 alloy and the effects of process parameters on the interface structure,interface bonding holes and mechanical properties of the joints were investigated.The experimental results without interlayer show that with the increase of diffusion time and diffusion pressure in the range of 950-1 150℃,both the number and size of interface bonding hole decrease and the maximum tensile strength is 658 MPa,but the discontinuous interface holes still exist.With the Cu interlayer,the solid solution layer exists on the interface and the maximum tensile strength is 745 MPa. |
| Key words: nickel-base alloy diffusion bonding interlayer tensile strength |
