| 摘要: |
| 制备了含不同Bi,P元素的(Sn-9Zn0.05Ce)xBi和(Sn-9Zn0.05Ce)xP钎料合金,观察并分析了钎料的显微组织形貌,测试了钎料的抗拉强度、断后伸长率以及维氏硬度.结果表明,添加Bi元素能显著提高Sn-9Zn0.05Ce钎料合金的抗拉强度和硬度,但同时会明显降低其断后伸长率,而添加微量P元素对钎料的抗拉强度与硬度没有明显的影响.此外,添加Bi和P元素均能促使钎料析出针状或颗粒状富锌相,富锌相随Bi或P元素添加量的增加而增多,并因此影响钎料合金的力学性能. |
| 关键词: 锡-锌钎料 显微组织 抗拉强度 硬度 |
| DOI： |
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| 基金项目:重庆市重点自然科学基金资助项目(2006BA4034);重庆科技学院校内科研基金项目(CK2010B23) |
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| Influence of Bi and P additions on microstructure and mechanical properties of Sn-Zn-RE solder |
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DU Changhua1, YIN Limeng2, SU Jian1, CHEN Fang1, ZHAO Haijian1
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1.School of Materials Science and Engineering, Chongqing University of Technology, Chongqing 400054, China;2.School of Metallurgy and Materials, Chongqing Institute of Science and Technology, Chongqing 401331, China
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| Abstract: |
| The Sn-9Zn0.05Ce lead-free solder with Bi and P additions were prepared, and microstructure, tensile strength, elongation and Vickers hardness of the lead-free solders were studied. Experimental results show that the tensile strength and hardness increase with more Bi addition in Sn-9Zn0.05Ce lead-free solder, while the elongation decreases with Bi addition. P addition in Sn-9Zn0.05Ce lead-free solder does not obviously affect the tensile strength and hardness. In addition, either Bi or P addition in Sn-9Zn0.05Ce lead-free solder would make Zn separate out from Sn-9Zn0.05Ce lead-free solder more easily, and needle-like or grain-like Zn-rich phase can be found in the solder. Moreover, Zn-rich phase increases with more Bi or P additions in the solder, and accordingly has a great effect on the mechanical properties of Sn-9Zn0.05Ce solder. |
| Key words: Sn-Zn0.05Ce solder microstructure tensile strength hardness |
