| 摘要: |
| 采用活性钎料TiZrNiCu对TiBw/TC4钛合金和C/C复合材料进行了钎焊连接,借助SEM,EDS,XRD等分析手段研究了钎焊工艺参数对接头界面组织结构的影响.结果表明,采用TiZrNiCu钎料可以实现对两种材料的连接,接头典型的界面结构为:C/C复合材料/TiC+(Ti,Zr)2(Cu,Ni)/Ti(s,s)+(Ti,Zr)2(Cu,Ni)/TiBw/TC4钛合金.随着连接温度的升高或保温时间的延长,钎焊接头界面生成产物的种类并没有发生改变,但C/C复合材料侧TiC反应层逐渐变得连续且厚度逐步增加,α-Ti枝状晶变得粗大且数量增多,Ti(s,s)+(Ti,Zr)2(Cu,Ni)层逐渐变宽,(Ti,Zr)2(Cu,Ni)逐步分散在Ti(s,s)中. |
| 关键词: TiBw/TC4钛合金 C/C复合材料 真空钎焊 界面组织结构 |
| DOI： |
| 分类号: |
| 基金项目:国家自然科学基金资助项目(51021002,E050803);中央高校基本科研业务专项资金资助项目(HIT.BRET1.2010006,HIT.NSRIF.2010119);浙江省钎焊材料与技术重点实验室开放基金项目资助项目(0901) |
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| Microstructure of TiBw/TC4 alloy and C/C composite brazed joint |
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HUANG Chao1,2, LIN Tiesong1, HE Peng1, GU Xiaolong3
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1.State Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China;2.Aerospace Research Institute of Materails & Processing Technology Beijing, 100076, China;3.Zhejiang Province Key Laboratory of Soldering & Brazing Materials and Technology, Zhejiang Metallurgical Research Institute Co., Ltd, Hangzhou 310030, China
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| Abstract: |
| The active filler containing TiZrNiCu was used to join TiBw/TC4 alloy and C/C composite. The effect of the brazing parameters on the interfacial microstructure was studied by SEM, EDS, and XRD. The results show that the typical interfacial structure of the joint is C/C composites/TiC +(Ti,Zr)2(Cu,Ni)/Ti(s,s) +(Ti, Zr)2(Cu, Ni)/TiBw/TC4 alloy. With the increasing of brazing temperature or holding time, the type of the interfacial products in the brazing joint did not change, but the reaction layer of TiC near the C/C composites became continuous and thickness gradually increased, α-Ti dendrites became thicker and the number increased. The layer of Ti(s, s) +(Ti, Zr)2(Cu, Ni) became wider, the phase(Ti, Zr)2(Cu, Ni) gradually dispersed in Ti(s,s). |
| Key words: TiBw/TC4 alloy C/C composite brazing microstructure |
