| 摘要: |
| 采用AgCu箔片对不同置氢含量的TC4钛合金与C/SiC复合材料进行了钎焊连接.借助SEM,EDS,XRD等分析手段对接头的微观组织、界面结构进行研究,并分析了钎焊工艺参数的影响.结果表明,钎焊温度810℃,保温时间10 min时,置氢含量0.3%的接头界面结构为置氢钛合金/针状韦德曼组织/Ti(s.s)+Ti2Cu过共析组织/Ti2Cu+TiCu+Ti3Cu4扩散带/Ag(s.s)+Cu(s.s)/Ti2Cu+Ti5Si3/TiC/复合材料.不同氢含量下接头的界面产物基本相同,但接头反应层总厚度随置氢含量的增加而增大.随着钎焊温度升高或时间延长,复合材料侧Ti5Si3等化合物逐渐增多,TiC反应层变得连续且厚度增加. |
| 关键词: 置氢钛合金 复合材料 真空钎焊 界面结构 |
| DOI： |
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| Interface structure of brazing joint between hydrogenated TC4 titanium alloy and C/SiC composite |
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WANG Yuxin1,2, ZHANG Lixia1, WANG Jun1, FENG Jicai1
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1.State Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China;2.Engineering Welding Room of the Institute of Nuclear Equipment, China Nuclear Power Engineering Co. , Ltd. , Beijing 100840, China
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| Abstract: |
| Hydrogenated TC4 titanium alloy with different hydrogen content and C/SiC composite was carried out with brazing AgCu filler foil. The interfacial microstructure of the joints was analyzed by SEM,EDS,XRD etc. At the same time, the influence of different brazing parameters was examined. The results show that:the typical interface microstructure of brazed joints of 0.3% hydrogenated braced at 840℃ for 10 min could be expressed as titanium alloys/needle veidemann organization/Ti(s. s)+Ti2Cu hypereutectoid organization/Ti2Cu+TiCu+Ti3Cu4 diffusion layer/Ag(s. s)+Cu(s. s)/TiCu+Ti5Si3/TiC/Composite. The microstructure of the joints with different hydrogen content was basically the same, but the reaction layer became thicker as the hydrogen content increased. When the brazing temperature or holding time increased, the more and more Ti5Si3 compounds which closed to the composite was found, and the TiC reaction layer became continuous and thicker. |
| Key words: hydrogenated TC4 titanium alloy composite vacuum brazing interfacial microstructure |
