| 摘要: |
| 分别研究了Ag元素含量(质量分数,%)为0.3,1.0,2.0,3.0,3.8的Sn-Ag-Cu(SAC)无铅钎料合金的显微结构、熔化行为、力学性能、润湿性和界面金属间化合物(IMC)形貌.结果表明,随着Ag元素含量的增加,钎料内部金属间化合物晶粒越小,晶粒在钎料中的密度越高,晶粒间距越小,金属间化合物产生的弥散强化越明显,钎料的抗拉强度越高,但韧性越低.随Ag元素含量的提高,钎料越接近共晶成分,熔化温度范围越小.Ag元素含量对润湿性影响不明显,SAC0307/Cu焊点界面IMC晶粒比其它钎料细小. |
| 关键词: 无铅钎料 金属间化合物 显微组织 熔点 |
| DOI： |
| 分类号: |
| 基金项目:浙江省自然科学基金资助项目(Y4100809);浙江省科技计划资助项目(2010F20002) |
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| Properties of Sn-Ag-Cu lead free solders with different silver content |
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LIU Ping1,2, GU Xiaolong1, ZHAO Xinbing2, LIU Xiaogang1, ZHONG Haifeng1
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1.Zhejiang Province Key Laboratory of Soldering & Brazing Materials and Technology, Zhejiang Metallurgical Research Institute, Hangzhou 310011, China;2.Department of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, China
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| Abstract: |
| The microstructure,melting behavior,mechanical properties,wettability and interfacial intermetallic compound(IMC) were studied on Sn-Ag-Cu(SAC) lead free solders with different Ag content(0.3,1.0,2.0,3.0,3.8wt%).The result indicates that SAC solders with higher Ag content present finer and denser IMC particles in the bulk solder,as a result of which the tensile strength of SAC solders increases with the increasing of Ag content,while the ductility decreases.The melting temperature of SAC305 and SAC387 solders was close to eutectic point as they have small melting temperature range.It was found that the wettability and interfacial IMC grain size of SAC0307/Cu joint are better than other tested solders. |
| Key words: Sn-Ag-Cu lead-free solder IMC microstructure melting temperature |
