| 摘要: |
| 研究了锡须生长与稀土含量之间的关联性,对影响锡须生长的相关因素进行了初步分析,着重研究时效时间与冷却速率对锡须生长的影响规律,并对块状钎料合金表面锡须形成的生长机制进行了初步探讨.结果表明,当Sn-Zn-Ga-xPr钎料中镨的添加量达到0.7%(质量分数)时,钎料表面在室温时效12 h后会生长出锡须.随着时效时间的延长,Sn-Zn-Ga-0.7Pr钎料锡须长度增长,且在时效时间45 d左右达到电子元器件失效的临界值.此外研究发现不同冷却速率对锡须的生长有很大差异,对Sn-Zn-Ga-xPr钎料锡须生长机制进行了初步的理论分析. |
| 关键词: 无铅钎料 锡须 稀土元素 影响因素 生长机制 |
| DOI： |
| 分类号: |
| 基金项目:南京航空航天大学研究生创新基地(实验室)开放基金资助项目(201001016);2010年南京航空航天大学大学生"创新-创业"资助项目 |
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| Effect of Pr on whisker growth of Sn-Zn-Ga lead-free solder |
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CHEN Cheng1, XUE Songbai1, YANG Jingqiu2, YE Huan1, LI Yang1
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1.College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China;2.Harbin Welding Institute, Harbin 150000, China
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| Abstract: |
| Relation between Sn whisker growth and the amount of rare earth was studied.The influence factor of Sn whisker growth was initially analyzed, especially in the aspect of aging time and cooling rate.Furthermore, the growth mechanism of Sn whisker growth on the surface of the solder was initially discussed.The experimental results show that with the addition of 0.7% Pr to Sn-Zn-Ga-xPr solder, Sn whisker could spontaneously grow on the surface of the solder only after aging 12 hours.With the increasing of aging time, the length of Sn whisker grew rapidly, which could reach the critical value of failure after aging about 45 days.It was also found that the growth morphologies of Sn whisker with different cooling rates have diversity.Finally, the mechanism for whisker growth in Sn-Zn-Ga-xPr was initially discussed. |
| Key words: Pb-free solder Sn whisker rare earth influence factor growth mechanism |
