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| 微米氧化银膏原位生成纳米银的低温烧结连接 |
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母凤文1, 邹贵生1, 赵振宇1, 吴爱萍1, 闫久春2, Y. Norman Zhou1,3
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1.清华大学机械工程系, 先进成形制造教育部重点实验室, 北京 100084;2.哈尔滨工业大学先进焊接与连接国家重点实验室, 哈尔滨 150001;3.Department of Mechanical and Mechatronics Engineering, University of Waterloo, ON, N2L 3G1, Canada
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| 摘要: |
| 为降低纳米银膏用于低温烧结电子互连封装的成本,用较低廉的微米级Ag2O粉末与三甘醇配制成膏.文中研究了其原位生成纳米银的反应机理、低温烧结特性并用其低温烧结连接镀银铜块.结果表明,三甘醇还原微米级Ag2O原位生成纳米银的温度远低于Ag2O粉本身的分解温度,同时生成可以逸出的气体,且随温度升高和保温时间延长,生成的银颗粒增多并逐渐烧结长大形成颈缩式颗粒.在烧结连接温度250℃和外加压力2 MPa条件下,烧结保温时间延长可显著提高接头强度,保温5 min可获得抗剪强度为24 MPa的接头,并对典型条件下的接头断口和横截面显微组织结构进行了分析. |
| 关键词: 氧化银 原位生成 纳米银颗粒 烧结连接 |
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| 基金项目:国家自然科学基金资助项目(51075232);先进焊接与连接国家重点实验室开放课题研究基金重点资助项目(AWPT-Z12-04);清华大学自主科研计划资助项目(2010THZ 02-1) |
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| Low temperature sintering-bonding through in-situ formation of Ag nanoparticles using micro-scaled Ag2O composite paste |
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MU Fengwen1, ZOU Guisheng1, ZHAO Zhenyu1, WU Aiping1, YAN Jiuchun2, Y. Norman Zhou1,3
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1.Key Laboratory for Advanced Materials Processing Technology (Ministry of Education), Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China;2.State Key Laboratory of Advanced Welding & Joining, Harbin Institute of Technology, Harbin 150001, China;3.Department of Mechanical and Mechatronics Engineering, University of Waterloo, Waterloo N2L 3G1, Canada
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| Abstract: |
| In order to reduce the cost of using Ag nanoparticle paste as bonding materials in electronic packaging,microscaled Ag2O powders were mixed with triethylene glycol (TEG) to form a paste to replace the Ag particle paste.The reaction mechanism of in-situ formation of Ag nanoparticles,the sintering characteristics of micro-Ag2O paste at low temperature,and the bonding of Ag-coated Cu bulks using this paste were investigated.The results reveal that the Ag2O particles in the paste were more easily transformed into Ag nanoparticles than micro-Ag2O itself,and with increasing the sintering temperature,more Ag nanoparticles formed and grew larger by sintering,accompanied with some gaseous products which could escape easily.The effect of sintering-bonding time on the strength of joints fabricated at 250℃ under a pressure of 2 MPa was analyzed.The average shear strength of the joints increased with sintering-bonding time and reached about 24 MPa when the sintering-bonding time was 5 min.And the microstructure of the fractured surface and the cross-section of typical joints made at 250℃ under 2 MPa were also examined. |
| Key words: silver oxide in-situ formation Ag nanopartcles sintering bonding |
