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| Al-Si-Cu合金粉末扩散钎焊Al/Cu接头组织及性能 |
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南水平1,2, 黄继华1, 陈树海1, 赵兴科1, 王奇3, 李德华3
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1.北京科技大学材料科学与工程学院, 北京 100083;2.中国电子科技集团公司第二十九研究所, 成都 610036;3.珠海格力电器股份有限公司, 珠海 519070
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| 摘要: |
| 采用Al-Si-Cu合金粉末扩散钎焊铝铜异种金属,采用SEM,EDS和XRD分析接头微观组织结构,结合三元相图分析了接头形成机理,最后检测了接头力学性能.结果表明,在连接温度530℃,保温时间60 min,压力为1MPa时可形成均匀致密的接头,接头中存在大量条状和鱼骨状的Al-Si-Cu共晶组织,中间层与两母材结合界面处的组织结构不同,在靠近铜侧界面存在三种层状金属间化合物,其成分依次为Cu3Al2,CuAl和CuAl2,在靠近铝侧界面存在一个扩散区,没有形成层状金属间化合物.接头的抗剪强度随保温时间的变化而变化,在保温60 min时达到35 MPa. |
| 关键词: 扩散钎焊 显微组织 抗剪强度 |
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| Microstructure and properties of diffusion brazed aluminum/copper joint with Al-Si-Cu alloy powder |
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NAN Shuiping1,2, HUANG Jihua1, CHEN Shuhai1, ZHAO Xingke1, WANG Qi3, LI Dehua3
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1.School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China;2.Southwest China Research Institute of Electronic Equipment, Chengdu 610036, China;3.Gree Electric Appliances, Inc. of Zhuhai, Zhuhai 519000, China
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| Abstract: |
| Al-Si-Cu alloy powders were used as insert layers for diffusion brazing of aluminum/copper dissimilar metals. The microstructure of resulted Al/Cu joints was observed by SEM,EDS and XRD. The mechanism of joint formation was analyzed with ternary phase diagrams. The mechanical properties of the joints were tested. The results show that uniform and compact joints were obtained at 530℃ for 60 min under the applied pressure of 1 MPa. A large number of eutectic phases existed in the joint. The interfaces on both sides were different. Cu3Al2,CuAl and CuAl2 formed near the interface on copper substrate side, but a diffusion area without IMC existed near the interface on aluminum substrate side. The shear strength of the joints changed with the holding time. The maximum shear strength of the joint brazed at 530℃ for 60 min reached 35 MPa. |
| Key words: diffusion brazing microstructure shear strength |
