| 摘要: |
| 基于自制原位观察装置,研究了Sn-3.0Ag-0.5Cu/Cu焊点在110℃恒温时效下,0~168 h不同时效时间界面金属间化合物(IMC)的微观形貌和生长变化规律.结果表明,随着时效时间的延长,界面IMC(Cu6Sn5和Cu3Sn)的厚度在不断增加;同时IMC的生长具有三维特性;随着时效时间的延长,Cu6Sn5在纵向方向上变化比较明显,高度是逐渐降低的;而在横向方向上变化较慢.SEM研究发现,时效过程中界面IMC的形貌由扇贝状转变成较为平整的层状,并出现分层现象. |
| 关键词: 金属间化合物(IMC) 微观形貌 三维特性 分层现象 |
| DOI： |
| 分类号: |
| 基金项目:国家自然基金资助项目(51175151) |
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| In-situ observation on microstructure of Sn-3.0Ag-0.5Cu solder/Cu joint during long-term aging at 110℃ |
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LI Shuai, YAN Yanfu, ZHAO Yongmeng, WANG Hongna
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College of Material Science and Engineering, Henan University of Science and Technology, Luoyang 471003, China
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| Abstract: |
| Based on the home-made in-situ observation device, the microstructure and the growth kinetic of Sn-3.0Ag-0.5Cu solder/Cu joint were investigated under 110℃ thermal exposure condition. The intermetallic compounds(IMCs) presented at interface was thickened with increasing exposure time. At the same time, the growth of IMCs have three-dimensional characteristics. The Cu6Sn5 varied evidently in the longitudinal direction with a gradual decrease of height, while it was changeed slowly in in the transverse direction with the aging time. The SEM shows that the microstructure of IMCs varied from the scallop-shape to a layered structure with stratified phenomenon. |
| Key words: IMC microstructure three-dimensional characteristics stratified phenomenon |
