| 摘要: |
| 研究了硼酸铝晶须对Sn-58Bi/Cu界面金属间化合物(IMC)层组织演变的影响.结合钎焊接头显微组织、剪切性能以及断口形貌,分析了Sn-58Bi-1.2%Al18B4O33钎焊接头的断裂机理.结果表明,硼酸铝晶须的加入可以细化钎料组织,抑制大块富铋相的出现;钎料/基板界面IMC层厚度和晶粒粒径均随着重熔次数的增加而增大,但硼酸铝晶须的加入能够阻碍界面IMC层的增厚和晶粒粗化,提高钎焊接头的性能;不同重熔次数下Sn-58Bi-1.2% Al18B4O33/Cu钎焊焊点比Sn-58Bi/Cu钎料焊点能承受更高的剪切载荷,且经过多次重熔后接头强度保持稳定. |
| 关键词: 锡铋钎料 硼酸铝晶须 金属间化合物 力学性能 |
| DOI： |
| 分类号: |
| 基金项目:国家自然科学基金资助项目(51275135,51474081) |
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| Effect of Al18B4O33 whiskers on microstructure evolution of intermetallic compound layer and shear behavior of soldered joint |
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QIU Xiliang1, WANG Qian1, LIN Tiesong1, HE Peng1, LU Fengjiao2
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1.State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China;2.Jiangsu Shuangliang New Energy Equipment[HJ1. 25mm]Corporation Limited, Jiangyin 214444, China
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| Abstract: |
| The effect of Al18B4O33 whiskers on the microstructure evolution of the intermetallic compound(IMC) layer on the Sn-58Bi/Cu interface was investigated, and the fracture mechanism of the Sn-58Bi-1.2% Al18B4O33 soldered joint was analyzed. The results show that, the addition of Al18B4O33 whiskers to the solder refines the solder microstructure, inhibits the formation of large pieces of Bi-rich phase. The thickness and grain size of the interfacial IMC layer are increased with the increase of the remelting cycles, but the addition of Al18B4O33 whiskers to the solder hinders the interfacial IMC layer thickening and grain coarsening, which improves the mechanical property of the brazing joint. The Sn-58Bi-1.2% A118B4O33/Cu soldered joint can bear higher shear stress than the Sn-58Bi/Cu soldered joint after multi-remelting, and its strength remains stable after multi-remelting. |
| Key words: Sn-Bi solder A118B4O33 whisker intermetallic compound mechanical property |
