| 摘要: |
| 采用合金化原理,在Zn20Sn钎料基体中添加不同含量铜,形成新型合金Zn20SnxCu,研究铜含量对Zn20SnxCu无铅钎料腐蚀性能影响. 结果表明,当铜添加量小于4%时,随着铜添加量的增加,Zn20SnxCu钎料合金的腐蚀电位逐渐升高,腐蚀速率逐渐降低,合金耐腐蚀性逐渐增强;当铜添加量大于4%时,随着铜添加量的增加,Zn20SnxCu钎料合金的腐蚀电位逐渐降低,腐蚀速率增加,耐腐蚀性下降. Zn20SnxCu腐蚀表面主要产物为Zn5(OH)8Cl2·H2O和ZnO. 从Zn20SnxCu腐蚀性能考虑,铜最佳添加量为4%. |
| 关键词: Zn20SnxCu钎料 腐蚀电位 腐蚀速率 |
| DOI： |
| 分类号: |
| 基金项目:国家自然科学基金资助项目(51175151) |
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| Impact of Cu content on corrosion property of Zn20Sn lead-free solder |
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MA Shitao, YAN Yanfu, WANG Hongna, ZHAO Yongmeng
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School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471003, China
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| Abstract: |
| New types of alloys Zn20SnxCu were prepared by adding different contents of Cu into Zn20Sn master alloy, using alloying principle, and the effect of Cu content on the corrosion resistant property of Zn20Sn solder alloy was investigated. The results show that when the Cu content was less than 4%, the corrosion potential of Zn20SnxCu solder alloy increased, the corrosion rate reduced gradually, and the corrosion resistance of solder alloy increased with the increase of Cu content. When the Cu content was more than 4%, the corrosion potential of Zn20SnxCu solder alloy reduced, the corrosion rate increased gradually, and the corrosion resistance of solder alloy reduced with the increase of Cu content. The main products on the corrosion surface of Zn20SnxCu were Zn5(OH)8Cl2·H2O and ZnO. Considering the corrosion performance of Zn20SnxCu, the optimized addition amount of Cu is 4%. |
| Key words: Zn20SnxCu solder corrosion potential corrosion rate |
