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| 复合添加Ga/Nd对超低银SAC钎料组织和性能的影响 |
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薛鹏1, 周琦1, 王克鸿1, 张德库1, 何鹏2, 龙伟民3, 钟素娟3
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1.南京理工大学材料科学与工程学院, 南京 210094;2.哈尔滨工业大学先进焊接与连接国家重点实验室, 哈尔滨 150001;3.郑州机械研究所新型钎焊材料与技术国家重点实验室, 郑州 450001
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| 摘要: |
| 研究了复合添加Ga/Nd对超低银Sn-0.3Ag-0.7Cu钎料组织和性能的影响.结果表明,复合添加微量Ga/Nd元素(0.025~1%)可以显著改善钎料的润湿性能,当Nd元素的添加量为0.1%时钎料的润湿时间最短,润湿力,此时钎料在250℃时的润湿时间已达到了波峰焊的应用标准.添加适量Ga/Nd元素后钎料组织得到了明显细化,当Nd元素的添加量为0.1%时钎料组织最为细小均匀,同时焊点抗剪力相比母合金提升了约15%.当添加过量稀土元素后,结果表明,在钎料组织中并未发现明显的稀土相,说明Ga/Nd复合添加对稀土相的生成起到了一定的抑制作用. |
| 关键词: Sn-Ag-Cu 润湿性能 显微组织 Ga/Nd |
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| 基金项目:新型钎焊材料与技术国家重点实验室开放课题(郑州机械研究所SKLABFMT201604);江苏省自然科学基金资助项目(BK20131261) |
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| Effect of Ga/Nd composite additive on the wettability and microstructure of low silver Sn-Ag-Cu solder |
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XUE Peng1, ZHOU Qi1, WANG Kehong1, ZHANG Deku1, HE Peng2, LONG Weimin3, ZHONG Sujuan3
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1.School of Materials Science and Engineering, Nanjing University of Science and Technology, Nanjing 210094, China;2.State Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China;3.State Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001, China
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| Abstract: |
| The effect of Ga/Nd composite additive on the wettability and microstructure of n-0.3Ag-0.7Cu solder were investigated.The results indicated that the composite additive of Ga and Nd could greatly improve the wettability of solder, the optimal wettability of solder was obtained when the addition of Nd reached 0.1 wt.%. After adding moderate amount of Ga and Nd, the microstructure of solder was refined andthe shear strength of soldered joint was improved by 15%. Compared with the previous results that excessive amount of Nd was added, no obviously Sn-Nd phase observed in the solder, indicating that the composite additive of Ga and Nd could inhibit the formation of Sn-Nd phase to a certain extent. |
| Key words: Sn-Ag-Cu wettability microstructure Ga/Nd |
