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| 倒装LED回流焊接头组织的抗高温时效性能 |
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张洪林1, 刘洋1,2,3, 孔祥瑞1, 孙凤莲1, 袁长安2, 张国旗3
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1.哈尔滨理工大学材料科学与工程学院, 哈尔滨 150040;2.半导体照明联合创新国家重点实验室, 常州 213161;3.代尔夫特理工大学北京研究中心, 北京 100083
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| 摘要: |
| 以SAC305锡膏为钎料,通过回流焊实现了倒装LED与Cu/Ag、Cu/Ni/Au基板的互连.研究了两种接头界面微观组织在高温时效条件下的演变行为.结果表明,接头两侧界面组织间存在相互影响. Cu/Ni/Au基板中的Au在回流焊过程中溶解至体钎料内,对芯片侧Au-Sn金属间化合物的生长起到抑制效果.芯片侧Au-Sn金属间化合物的快速生长降低了体钎料中Sn的相对浓度,从而使体钎料中有利于基板侧IMC生长组元的相对浓度得到提升,促进基板侧IMC生长.相比较而言,在Cu/Ag基板上的回流焊试样抗高温时效性能较差. |
| 关键词: 倒装LED 回流焊 高温时效 界面微观组织 |
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| 基金项目:黑龙江省普通本科高等学校青年创新人才培养计划资助项目(UNPYSCT-2015042);黑龙江省教育厅科研资助项目(12541112);黑龙江省大学生创新创业资助项目(201310214035) |
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| Thermal aging resistance of the microstructure of solder joints for flip-chip LED |
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ZHANG Honglin1, LIU Yang1,2,3, KONG Xiangrui1, SUN Fenglian1, YUAN Changan2, ZHANG Guoqi3
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1.College of Material Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China;2.State Key Laboratory of Solid State Lighting, Changzhou 213161, China;3.Beijing Research Centre, Delft University of Technology, Beijing 100083, China
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| Abstract: |
| Flip-Chip LEDs were reflow soldered to Cu/Ag and Cu/Ni/Au substrates using SAC305 solder paste. The microstructure evolutions of the two kinds of sample during high-temperature aging were investigated in this study. Experimental results indicated that there was some interactions between the microstructure on both side of the solder joints. Au layer on Cu/Ni/Au substrate was melted into the bulk solder during the reflow which depressed the growth of Au-Sn intermetallic compounds during aging. Meanwhile, the fast growth of Au-Sn layer on the chip side decreased the relative concentration of Sn in the bulk solder. Consequently, the relative concentration of other elements, including the elements having positive effect for the IMC growth on the substrate, was increased.Compared with the two kinds of sample, the samples on Cu/Ag substrates show poorer thermal aging resistance. |
| Key words: Flip-Chip LED soldering high-temperature aging interfacial microstructure |
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