| 摘要: |
| 研究了Sn-9Zn/Cu无铅焊点ZnO须自发生长行为.结果表明，在室温条件下Sn-9Zn/Cu无铅焊点因为富锌相的氧化，在富锌相表面自发生长出大量的ZnO须，ZnO须呈现针状、块状、花朵状等不同形态；对ZnO须进行FIB测试，发现在富锌相中出现明显的空洞，主要是因为Zn元素扩散导致的.另外，证实在Zn元素扩散与氧发生反应的过程中，富锌相发生体积收缩，诱使结构中出现明显的拉应力，拉应力为ZnO须生长提供驱动力. |
| 关键词: 无铅焊点 富锌相 ZnO须 拉应力 |
| DOI： |
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| 基金项目:国家自然科学基金项目（51475220）；新型钎焊材料与技术国家重点实验室开放课题（SKLABFMT-2015-03） |
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| Spontaneous growth of ZnO whiskers in Sn-9Zn/Cu lead-free solder joints |
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ZHANG Liang1, YANG Fan1, GUO Yonghuan1, ZHONG Sujuan2, MA Jia2, BAO Li2
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1.School of Mechanical & Electrical Engineering, Jiangsu Normal University, Xuzhou 221116, China;2.State Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001, China
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| Abstract: |
| Spontaneous growth of ZnO whiskers in Sn-9Zn/Cu lead-free solder joints was investigated. The results indicate that due to the oxidation of rich-Zn phases at room temperature, ZnO whisker will spontaneously grow on the surface of Zn-rich phase in Sn-9Zn/Cu lead-free solder joints, and these whiskers showed different morphologies like needle-type, bulk-type and flower-type, etc. Based on FIB test of ZnO whisker, it was found that voids appeared in the Zn-rich phase, which was induced by the diffusion of Zn atoms. In addition, during reaction between Zn and O, volume shrinkage of Zn-rich phase might happen, and the tensile stress could be generated in the structure which was the driving force of ZnO whisker growth. |
| Key words: lead-free solder joints rich-Zn phases ZnO whiskers tensile stress |
