| 摘要: |
| 推导了恒定激光脉冲激励作用下的焊点瞬态热平衡方程，及基于极限温差反问题识别的缺陷尺寸及热阻解析求解方法；通过建立空洞缺陷焊点数字化模型，对恒定激光脉冲激励过程进行了热分析仿真，得到了焊点温差、热阻及缺陷尺寸之间的演化规律；通过制备虚焊缺陷焊点试验样本，实施了不同温度参数组合下的热试验，并对热试验后的焊点缺陷演化情况进行红外测温分析.试验结果表明，热试验过程中的焊点缺陷演化机理具有与金属材料蠕变曲线相似的变化规律，缺陷尺寸呈现先增大、后减小及再增大的变化行为，有助于完善和补充焊点的热试验理论. |
| 关键词: 热仿真 红外测温 焊点缺陷 热试验 |
| DOI： |
| 分类号: |
| 基金项目: |
|
| Thermal simulation and test investigation on soldered joint defect of electronic product |
|
LIU Shouwen1,2, KONG Lingchao3, HUANG Xiaokai1,2, LIN Boying1,2
|
|
1.Beijing Key Laboratory of Environment & Reliability Test Technology for Aerospace Mechanical & Electrical Products, Beijing 100094, China;2.Beijing Institute of Spacecraft Environment Engineering, Beijing 100094, China;3.State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
|
| Abstract: |
| This paper deduced the transient thermal balance equation for soldered joint under the constant laser pulse excitation, as well as analysis calculation method for defect size and thermal resistance based on the inverse problem of limit temperature difference. Then thermal analysis simulation of constant laser pulse excitation was conducted by establishing digital model for void-type defects. The evolution law among infrared temperature difference, thermal resistance and defect size of soldered joint was obtained. By preparing samples with pseudo soldering or defects, thermal test was conducted under different temperatures, and infrared temperature testing was carried out to analyze the evolution of soldered joint defects after thermal test. The results indicate that the evolution mechanism of soldered joint defect followed the change law similar to that of metal material creep curve. And the size of defects changed in the order of increasing, then decreasing, and then increasing again. The results could help to improve the thermal test theories for soldered joint. |
| Key words: thermal simulation infrared temperature testing soldered joint defect thermal test |
