铝/钢固态焊接合界面金属间化合物生长机制

Growth mechanism of intermetallic compounds at the solid-state joining interface of aluminum/steel

关键词:  纯铝  低碳钢  生长机制

Key words:  pure aluminum  mild steel  growth mechanism

摘要:

在保持固态条件下，分别变化加热温度、时间对铝/Q235钢爆炸焊接头进行加热处理.分析了接合界面区反应层形貌等微观特征，探讨了加热温度、加热时间对反应层厚度的影响，研究了接合界面金属间化合物的生长行为.界面反应物是由靠近铝合金侧的反应物为Fe₄Al₁₃和靠近钢侧反应物为Fe₂Al₅构成.金属间化合物层随着加热时间的延长而变厚.结果表明，金属间化合物的生长满足抛物线法则，其生长激活能为33.26 kJ/mol.

Abstract:

The explosive welded Al/Q235 joint was annealed under various heating time and temperature keeping the joint stay at solid state condition. The interfacial reaction layer feature was analyzed and the effects of heating temperature and time on the thickness of reaction layer were investigated, the growth of intermetallic compound at the joining interface was studied. The interfacial reaction layer consisting of Fe₂Al₅ adjacent to steel and Fe₄Al₁₃ adjacent to aluminum formed in the joining interface. The thickness of intermetallic compound increased with the longer of heating time. The results show that the growth of intermetallic compound satisfies the parabolic rule and that the growth active energy is 33.26 kJ/mol.