复杂背景下X射线BGA焊点气泡检测

Void detection of BGA solder joints under complex X-ray imaging background

关键词:  BGA焊点  射线轮廓提取方法  气泡检测

Key words:  BGA sober joints  ray contour extraction method  void detection

摘要:

基于全局阈值分割的焊点气泡提取不准确,且当焊点被遮挡造成的气泡提取困难时,导致球栅阵列(ball grid array,BGA)焊点气泡检测困难. 针对这些复杂背景下BGA焊点气泡的X射线缺陷检测问题,采用阈值分割、焊点圆度、焊点面积等标准提取未被遮挡的焊点,并提出了一种交互式射线轮廓提取方法完成被遮挡焊点轮廓的提取. 针对焊点气泡的特点,提出基于灰度形态学、直方图拉伸、模糊增强、BLOB分析综合处理的焊点气泡检测方法. 对比试验研究结果表明,该算法对复杂背景下BGA焊点气泡检测有较高准确率.

Abstract:

The void extraction method of solder joints based on global threshold segmentation is inaccurate. Moreover, once the solder joint in the image is shaded, the extraction of BGA solder joint's voids will become difficult. In order to detect the void defects of BGA solder joints under complex X-ray imaging background, it was detected that the unobstructed solder joints based on thresholding, solder roundness and solder area, and an interactive method of X-ray contour extraction to detect the obstructed solder joints was propose. According to the characteristics of solder buddle, an integrated method of solder joint's void extraction was presented based on grayscale morphology, histogram stretching, fuzzy enhancement and BLOB analysis. The result of comparison experiment shows that the method presented in this research possesses high accuracy in detecting the void defect of BGA solder joints.